Ⅰ. Product Details
Targeted Performance: As a specialized High Temperature Silicone Pressure Sensitive Adhesive, the 702 series offers a toluene-based solution that can be used across a broad temperature range and can even be combined with other methyl siloxane adhesives to customize specific performance characteristics.
Low Surface Energy Bonding: Specifically engineered to bond challenging materials including silicones, fluoropolymers, and polyolefins with high reliability.
High-Heat Resistance: Demonstrated temperature resistance at $230^{\circ}C$ for 30 minutes with no residue left during hot peeling, and a holding power that withstands $260^{\circ}C$ for 3 hours without displacement.
Chemical & Process Resilience: Features excellent chemical resistance, making it suitable for rigorous electroplating, gold plating, and sandblasting processes.
Ⅱ. Product Details
| Category | Index | 7022 | 7025 | 7028 | 7029 |
| Physicochemistry Index | Appearance | Colorless transparent viscous liquid | |||
| Solid Content(150℃*2h), % | 52-55 | 56-58 | 59-61 | 58-60 | |
| Viscosity(25℃), cp | 5-11W | 3-9W | 3-12W | 3-12W | |
| PH | 7 | 7 | 7 | 7 | |
| Specific Gravity(25℃) | 0.98 | 0.98 | 0.98 | 0.98 | |
| Bonding Properties After Vulcanization | Initial Adhesion(Steel Ball Number,∠30) | ≤16 | 14-23 | 14-23 | 14-24 |
| Peel Strength – PET transparent film(g/25um) | 200-300 | 400-600 | ≥800 | ≥900 | |
| Peel Strength – 1% wt color paste added(g/25um) | 80-150 | 300-500 | ≥700 | ≥800 | |
| Holding Power(260℃*3h) | No displacement | ||||
| Temperature Resistance(230℃*30min) | No residue in hot peeling | ||||
| Note: Dispensing ratio, original glue: thinner: BPO=100/65/1.5-2.0, solvent removal at 90℃*2min, curing at 160℃*6min; Test conditions: 25℃， 55-65%RH, 38um PET film thickness, 20-25 um cured glue thickness. | |||||
Ⅲ. Packaging and Storage
Ⅳ. Primary Applications
Electronics Manufacturing: Shielding for printed circuit board (PCB) electroplating, SMT processes, and FPC applications.
Specialized Tapes: Coating on PET, aluminum foil, and other substrates to manufacture high-temperature industrial tapes.
Industrial Protection: Shielding during gold plating, sandblasting, or high-temperature painting, and as insulation bandages for electrical products.
Ⅴ. Instructions
Curing Agent Dosage: Peroxide (such as BPO or DPP) is recommended at a dosage of 1.5% to 2.5% of the glue. Ensure it is completely dissolved in solvent before mixing.
Dilution & Filtering: Can be further diluted with toluene or xylene to an advisable working concentration of 35%. Use a 250 mesh filter screen before machine coating to ensure purity.
Application Window: The mixed peroxide dispersion liquid should be consumed within 1-2 days as the peroxide loses activity quickly in solvents.
Curing Conditions: Standard cycle involves solvent removal at 90℃ for 2 minutes followed by curing at 160℃ for 6 minutes.