BX-OSA-701 Silicone adhesive
The 701 series silicone adhesive is a kind of toluene solution based on polysiloxane rubber and resin adding additive. It has high heat resistance, softness and good insulation and moisture resistance. It is suitable for bonding fire-resistant mica tape and pressure sensitive tape. It has the performance of low smoke, good stability, high temperature resistance, no carbon out, and has good weather resistance, moisture resistancewetness and electrical insulation.
Ⅰ. Product Details
| Item | Index |
| Appearance | Colorless or light yellow transparent liquid, opalescent light is allowed, no mechanical impurity |
| Viscosity(25℃), cp | 10000-80000 [1] |
| Solid content (150℃, 2h), % | 60±2 |
| Density(25℃), g/cm³ | 1.0±0.02 |
| Note: [1] Viscosity can be customized according to customer requirements; the above data are for reference only and are not guaranteed technical specifications. *Supplementary Explanations: 1. “Opalescent light is allowed, no mechanical impurity” clarifies two key appearance requirements: faint iridescent/milky luster (normal for high-viscosity modified resin systems, e.g., silicone-modified epoxy or polyester) is acceptable, but visible solid particles (e.g., dust, undissolved impurities) are strictly prohibited—this ensures the product is suitable for high-quality coating or adhesive scenarios; 2. “Viscosity 10000-80000 cp (25℃)” belongs to ultra-high viscosity: the broad range (and customizability) allows adaptation to diverse application needs—lower end (10000-30000 cp) for thick-film brushing, higher end (50000-80000 cp) for vertical substrate coating (prevents sagging); 3. “Solid content (150℃, 2h) 60±2%” specifies the test condition (high temperature to fully volatilize solvents) and content range: 60% non-volatile components (resin, crosslinking agents) balance film-forming thickness and construction fluidity—avoids too-thin films (low solid content) or poor flow (high solid content); 4. “Density 1.0±0.02 g/cm³ (25℃)” is close to the density of water, indicating the product has good compatibility with water-based or low-density organic solvents—facilitating formulation adjustment (e.g., dilution ratio calculation) and ensuring uniform coating/adhesion on common substrates (metal, plastic, wood); 5. Combined with indicators, the product is likely a solvent-based ultra-high viscosity functional resin, applicable to scenarios like heavy-duty anticorrosive coatings, high-adhesion structural adhesives, or thick-film protective layers. | |
Ⅱ. Packaging and Storage
This product is packed in clear and dry 200KG or 1000L steel drum and sealed. Stored at room temperature (0~ 35℃). The effective storage period is 6 months.(Overdue the storage, if the product meet the standard, it can still be used.) Avoid direct sunlight. Be storied and transported as dangerous goods.
Ⅲ. Instructions
1.This product is two components, can be cured with peroxide BPO or our special curing agent.
2.Due to the difference of the substrate, coating equipment, curing period and required characteristics and other factors, the addition of the curing agent is 1.5 ~ 2.5% of the glue. In order to ensure the better mixture of the curing agent and the adhesive, the curing agent needs to be completely dissolved in the solvent and then added to the glue solution and mixed well. At the same time, the dilution liquid should be filtered once using more than 180 mesh filter screen before coating on the machine, to prevent the mixing of mechanical impurities.
3.The curing agent can be used to accelerate the curing speed or allow the curing at low temperature, and it can also improve the cohesion strength of the adhesive and improve the adhesion property of the adhesive. The mixed dispersion liquid should be used up within 1-2 days. That is because peroxide will lose its activity quickly in the solvent. To ensure the consistency of the finished product, the sufficient dispersion of adhesive and peroxide in the mixing process is necessary.
4.The 701 series binder can be directly coated on the substrate with traditional tape coating equipment. You can further dilute the adhesive with compatible solvent such as toluene and xslene. The advisable working liquid concentration is 18~20% that can be determined according to their own equipment and experience. When using the solvents, please ensure that it is good ventilated and comply with safety precautions and regulations of solvent suppliers.
5.Surface curing period: 80-90%C *2min Eliminate the solvent to ensure that there is no solvent in the glue when it enters he solidification zone; 150 ~170C*5 min, heating curing process further improves the adhesive force, cohesive strength and’ initial adhesion. But the exact conditions required for Vulcanization depend on the length, temperature and efficiency of the furnace, the type of curing agent and the type of substrate used. It must be tested on the device to determine the condition.
6.If temperature tolerance of the equipment and substrate is allowed, higher curing temperature can be used to shorten curing time. Compared to low temperature curing, raising the curing temperature can increase the cohesive strength of the adhesive in a shorter time.