Ⅰ. Product Features
Targeted Performance: As a specialized Silicone Adhesive for Mica Tape, BX-OSA-701 offers a unique blend of high temperature resistance and low smoke properties, ensuring no carbonization and maintaining excellent stability under extreme thermal conditions.
Superior Insulation & Protection: Provides outstanding electrical insulation and moisture resistance, effectively protecting sensitive components in high-humidity environments.
Flexible Processing: The adhesive maintains its softness after application, making it suitable for bonding various flexible substrates like fire-resistant tapes and pressure-sensitive tapes.
Enhanced Cohesion: When used with curing agents, it significantly improves the cohesive strength and adhesion properties of the finished product.
Ⅱ. Product Details
| Item | Index |
| Appearance | Colorless or light yellow transparent liquid, opalescent light is allowed, no mechanical impurity |
| Viscosity(25℃), cp | 10000-80000 [1] |
| Solid content (150℃, 2h), % | 60±2 |
| Density(25℃), g/cm³ | 1.0±0.02 |
| Note: [1] Viscosity can be customized according to customer requirements; the above data are for reference only and are not guaranteed technical specifications. | |
Ⅲ. Primary Applications
Mica Tape Production: Specifically designed for bonding fire-resistant mica tapes used in electrical insulation.
Tape Manufacturing: Ideal for the production of various pressure-sensitive tapes using traditional coating equipment.
Industrial Insulation: Suitable for components requiring high-temperature resistance and stable electrical performance.
Ⅳ. Packaging and Storage
Ⅴ. Instructions
Curing Process: This two-component product can be cured with peroxide BPO or specialized curing agents (1.5 ~ 2.5% dosage).
Dilution & Mixing: Can be further diluted with toluene or xylene to an advisable working concentration of 18~20%. Ensure the curing agent is completely dissolved before mixing.
Coating & Filtration: Use a 180 mesh filter screen before coating to prevent mechanical impurities.
Vulcanization: Recommended surface curing at $80\text{-}90^{\circ}C$ for 2 minutes to eliminate solvents, followed by $150\text{-}170^{\circ}C$ for 5 minutes for full solidification.